Key words: Intense magnetic fields, Cryogenics, Low temperatures, Magneto-resistance, CMR, GMR, Crystallography, Ceramics, Superconductors, Semiconductors, Dielectric, Nanomaterials, Faulty integrated circuits , Sensors, Microelectronics, Failure analysis , Integrated circuits.

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Development of functional materials for the manufacture of electronic and microelectronic components - Analysis of faulty integrated circuits
The Teams
The teams have roughly 110 people, including 75 scientists, 10 engineers, 20 technicians, and 5 administrative personnel
Equipments
The equipment includes:
	Phase contrast microscope (IDS 10000)
	4 transmission electronic microscopes including three high-resolution microscopes equipped with X EDS microanalysis
	Scanning electron microscope equipped with X-ray analysis
	Kappa CCD Diffractometer
	CAD4 Nonius 4-circle single crystal X-ray diffractometer
	Diffractometer for characterising materials (texture, reflectivity, high-resolution, and so on)
	Powder X-ray diffractometer
	Gas stream, high-temperature synthesis furnaces
	Image furnace
	Wafer deposit substrates: laser ablation, cathode sputtering and MBE
	Electric and dielectric measurements
	Two SQUID and vibrating sample magnetometers
	Alternating current susceptometer
	Resistivity transition measurements and Hall effect
	Laser beam particle size analyser
	Mössbauer spectrometer
	Electronic paramagnetic resonance
	Atomic absorption
	Thermal analyses (ATD, ATG, DSC, and TMA)
	Acoustic microscope
	FIB (Focus Ion Beam)
	Low temperature (2K to 300K), transport measurement under field (11 tesla)
Methods
The laboratories can do the following operations:
	The synthesis of new materials: micro-crystals, ceramics, and wafers
	The structural characterisation of these materials: electronic and X-ray microscopy
	The physical characterisation of materials: - electric measurements, low temperature and intense magnetic fields - magnetic measurements: magnetisation and magnetic relaxation
	The validation of the electronic properties of functional materials
	The analysis of faulty integrated circuits: - Packaging opening - X-ray analysis - microscopy (MEB and acoustic microscopy)
	DC and RF micro-probing and cryoprobing
	The functional analysis using phase contrast microscopy
	FIB to alter design based on layouts
Committed Companies
	Philips Semiconducteurs
	Tekelec
Contacts
For general technological or scientific information
	Mr. Christophe GOUPIL ISMRA - CRISMAT Tel : 33 (0)2 31 45 26 86 - Fax : 33 (0)2 31 95 16 00 christophe.goupil@ismra.fr
For economic or industrial information
	Normandie Développement 57 avenue de Bretagne - BP 1083 76173 Rouen Cedex 1 - France Tel : 33 (0)2 35 03 06 04 - Fax : 33 (0)2 35 03 07 86 ndrouen@normandydev.com